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Analysis and Features of AMD X870E and X870 Chipsets

GOOVER DAILY REPORT October 16, 2024
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TABLE OF CONTENTS

  1. Summary
  2. Introduction of AMD X870E and X870 Chipsets
  3. Chipset Features and Specifications
  4. Launch Timeline and Market Strategy
  5. Performance Capabilities
  6. Consumer Target and Product Segregation
  7. Conclusion

1. Summary

  • The report explores AMD's introduction of the X870E and X870 chipsets, which are designed to integrate with the Ryzen 9000 Series CPUs as part of their 800-series chipset family. These chipsets bring advancements in connectivity and computing capabilities, supporting technologies like PCIe 5.0, USB4, and DDR5 memory. The report details the architectural and performance differences between the X870E—characterized by its dual-chip configuration for superior bandwidth—and the single-chip X870, positioning them within AMD's broader strategy for motherboard technology and market segmentation. Scheduled to launch alongside the Ryzen 9000 series, these chipsets aim to serve both high-performance and mainstream consumer segments, promoting future AM5 platform compatibility.

2. Introduction of AMD X870E and X870 Chipsets

  • 2-1. Announcement of AMD's X870E and X870 chipsets with the Ryzen 9000 CPUs

  • AMD announced the introduction of the X870E and X870 chipsets, which are specifically designed to work with the Ryzen 9000 CPU series. These chipsets were unveiled as part of AMD's new 800-series chipset family, intended to advance the capabilities of the Ryzen 9000 processors. The X870E chipset is characterized by its dual-chip configuration that incorporates two Promontory 21 dies, which enhances its performance and connectivity features. Both chipsets are set to launch simultaneously with the Ryzen 9000 series processors, facilitating a seamless upgrade for users.

  • 2-2. Technologies supported: PCIe 5.0, USB4, DDR5

  • The AMD X870E and X870 chipsets provide comprehensive support for several cutting-edge technologies. Notably, they both support PCIe 5.0, which allows for higher data transfer rates necessary for demanding applications. Furthermore, these chipsets are compatible with USB4, enhancing connectivity options and streamlining data transfer processes. Additionally, they support DDR5 memory, which offers improved speeds over previous memory technologies. The advancements in memory speeds are complemented by AMD's EXPO technology, expected to facilitate memory speeds potentially up to DDR5-6000. These features make the X870E and X870 chipsets particularly powerful for high-performance computing scenarios.

3. Chipset Features and Specifications

  • 3-1. Detailed comparison between X870E and X870 chipsets

  • The AMD X870E and X870 chipsets are designed to seamlessly integrate with AMD Ryzen™ 9000 Series desktop processors and have several distinct features. The X870E features a dual-chip design with two Promontory 21 dies, providing superior connectivity and bandwidth compared to the X870, which utilizes a single Promontory 21 die. Both chipsets support PCIe 5.0 and USB4, ensuring higher data transfer rates and improved performance for high-demand applications. The X870E includes 24 PCIe 5.0 lanes, with 16 lanes allocated to graphics, effectively allowing it to double the bandwidth of competing platforms when enabling both storage and graphics simultaneously. In comparison, the X870 chipset, while having a robust configuration with 44 total PCIe lanes, does not match the enhanced capabilities of the X870E when it comes to connectivity options and overall performance.

  • 3-2. Support for advanced connectivity and USB4 standard features

  • Both the AMD X870E and X870 chipsets integrate USB4 support as a standard feature, enabling significant benefits such as faster data transfer rates and better connectivity for peripherals. This is particularly crucial for users reliant on high-speed data channels and efficient connection of modern devices. Moreover, the X870E chipset is designed to support faster DDR5 memory overclocking through AMD EXPO™ Technology, contributing to an anticipated increase in memory speeds that may rise to DDR5-5600 or even DDR5-6000. The chipsets prioritize high-performance computing applications by offering robust support for PCIe 5.0 and USB4, laying the groundwork for substantial performance improvements in both consumer and enterprise-grade systems.

4. Launch Timeline and Market Strategy

  • 4-1. Release schedule of motherboards featuring X870E and X870 chipsets

  • According to the documents, the AMD X870E and X870 chipsets are scheduled for retail launch on September 30, 2024. This release date comes two months after the introduction of the Ryzen 9000 CPUs. The launch plan was designed to align with the upcoming release of the next-gen Ryzen 9000X3D chips, although the exact date for that launch has not yet been confirmed. Additionally, AMD plans to release B850 and B840 chipsets to target the mainstream segment of the motherboard market.

  • 4-2. Strategic positioning regarding the AM4 and future AM5 platforms

  • AMD has strategically positioned its new X870E and X870 chipsets within its broader motherboard architecture by maintaining long-term support for the AM5 socket until at least 2027. This long-term commitment is a significant shift from the previous AM4 platform, which suggests stability for users through multiple generations of Ryzen CPUs. The X870E will utilize two Promontory 21 dies, supporting USB4 and up to Gen5 capabilities, while the non-E model will reduce the die count to one while retaining similar I/O support. Additionally, plans to adjust pricing for existing AM5 products are expected to stimulate market activity, particularly in light of clearing the current 600-series inventory. This strategic approach will enhance AMD's competitiveness in both high-performance and mainstream segments.

5. Performance Capabilities

  • 5-1. X870E’s architectural advantages in bandwidth and connectivity

  • The AMD X870E chipset provides significant architectural advantages particularly in terms of bandwidth and connectivity. It features a dual-chip design with two Promontory 21 dies, allowing for superior data transfer capabilities. Specifically, the X870E has 24 PCIe 5.0 lanes, with 16 lanes allocated to graphics, which enables it to deliver twice the bandwidth compared to competing platforms when graphics and storage are utilized simultaneously. This architecture facilitates enhanced connectivity options, including more additional M.2 sockets, making it particularly suited for high-performance computing tasks.

  • 5-2. Expected performance enhancements with Ryzen 9000 series

  • The AMD X870E and X870 chipsets are engineered to optimize performance in tandem with the Ryzen 9000 series processors. Both chipsets support high-speed DDR5 memory and PCIe 5.0, crucial for modern computing needs. Additionally, the incorporation of AMD EXPO Technology allows for improved memory overclocking capabilities, which is expected to uplift performance metrics beyond standard configurations. The alignment of their launch with the Ryzen 9000 series further positions these chipsets to enhance user experience through streamlined power delivery and throughput.

6. Consumer Target and Product Segregation

  • 6-1. Differentiation between high-end and mainstream market solutions

  • The AMD 800-series chipset family, including the X870E and X870, is designed with a clear differentiation strategy between high-end and mainstream market solutions. The X870E is characterized as a dual-chip solution incorporating two Promontory21 chipsets, supporting PCIe Gen5 x16 and at least one PCIe Gen5 SSD. Meanwhile, the X870 features a single Promontory21 chipset that supports PCIe Gen5 x16, but typically offers a different configuration for downstream general-purpose PCIe lanes. This distinction positions the X870E as the top-tier option, targeting enthusiasts and high-performance users, while the X870 caters to a broader audience seeking advanced functionality without the highest-end specifications.

  • 6-2. AMD’s revised segmentation approach with 800-series chipsets

  • AMD has revised its segmentation strategy with the introduction of the 800-series chipsets, which encompasses the X870E and X870 as the leading models. This revision is part of AMD's broader strategy to enhance the capabilities of newer processors, particularly the Ryzen 9000 series. The launch of the high-end X870E and X870 will be succeeded by options targeting the mainstream market, including anticipated B850 and B840 chipsets. The 800-series chipset family aims to cater to varying consumer needs by delivering enhanced features and improved I/O memory support, thereby marking a significant shift to encourage adoption of the new AM5 platform among both high-end enthusiasts and mainstream users.

7. Conclusion

  • The AMD X870E and X870 chipsets represent a critical step forward in AMD’s motherboard technology, characterized by integrated support for Ryzen 9000 Series CPUs. With technologies like PCIe 5.0 and USB4, these chipsets offer significant improvements in connectivity and data transfer rates, essential for modern high-performance computing. The dual-chip AMD X870E, with its expanded bandwidth capabilities, targets enthusiast markets, while the AMD X870 is tailored for mainstream consumers seeking advanced technology without dual-chip configurations. Despite a strategic delay in market entry to manage existing inventory levels, these chipsets anticipate widespread consumer adoption by 2027, particularly due to their long-term support for the AM5 platform. Future prospects include further advancements in this technology to maintain AMD's competitive edge. Real-world applications promise substantial enhancements in computing capabilities both for individual and enterprise-level use, particularly thanks to the adaptable and forward-looking platform these chipsets offer.

8. Glossary

  • 8-1. AMD X870E Chipset [Technology]

  • The AMD X870E chipset, featuring dual Promontory 21 dies, provides an advanced platform supporting PCIe 5.0, USB4, and DDR5. It offers twice the bandwidth for processing tasks, making it vital for high-performance computing, aligning with AMD's strategic deployment across enthusiast markets.

  • 8-2. AMD X870 Chipset [Technology]

  • A single-chip variant of the AMD X870E, this chipset retains core technological advancements like PCIe 5.0 and USB4, focusing on high-speed connectivity and improved memory capabilities, tailored for mainstream consumers seeking enhanced computing without the need for dual-chip architecture.

  • 8-3. Ryzen 9000 Series CPUs [Product]

  • The latest CPU family from AMD, featuring compatibility with the AM5 platform and designed to leverage the advanced capabilities of the X870E and X870 chipsets, offering enhanced memory speed and overclocking potentials for the new generation of processor technologies.

  • 8-4. PCIe 5.0 [Technology]

  • The fifth generation of PCI Express, providing significant improvements in transfer speeds, enabling faster data flow between the CPU and connected devices. It is a key feature in the newly introduced AMD X870 and X870E chipsets, illustrating AMD's commitment to performance uplift for both graphics and storage solutions.

9. Source Documents